SPI

Model		SLE SLE-D
Inspection System	Camera Resolution	5Mega Pixels
	Lighting System	Surrounding RGB Light Source
	FOV	48mm * 40mm (20 µm)
	Processing Time Per Screen	<0.7s
	Inspecting Content	Area, volume, height, shape, offset, even tin
	Defect type	Existence, more tin, less tin, continuous tin, offset, tip, collapse, irregular shape, insufficient height, height exceeding , etc
	Max. Inspecting range	400 µm
	Solder Paste Size	0.2mm x 0.2mm – 12mm x 12mm
	Inspecting Height Precision	1 µm
	Repeatability(Size/Area/Height)	<1 µm@3sigma
	Repeatability and reproducibility	<10%

Software System	Operating system		Windows 7 Ultimate 64 bit
	Identification	Feature	3D grating projection head(double head optional)
		Operate	Graphical programming, convenient operation, switchable Chinese and English systems
		Display	2D/3D True Color Image
		Mark Setting	Choose 2 commonly used Mark points
	Programming		Support Gerber, CAD import, offline programming and manual programming
	SPC	Offline SPC	Support
		SPC Chart	Any time period report
		Histogram/Control Chart	Volume, area, height, offset
		Export File	Report(Excel), Image(jpg/bmp)
Mechanical System	PCB delivery Method		PCB fixing method: edge-locked substrate clamping; automatic access board and automatic width adjustment system, in line with SMEMA standards; track height:900±30mm
	Min. PCB size		50mm x 50mm	50mm x 50mm
	Max. PCB size		500mm x 460mm	Double lane transmission:500mm x 330mm(one track ,four track fixed or one track, three tracks fixed according to customer needs)
	PCB Thickness		0.6mm-6mm
	Board Edge Gap		Top: 3mm Bottom: 3mm(Width of transport belt contact with OCB/fixture
	Delivery Speed		1500mm/s (MAX)
	Board Bending Compensation		<2mm
	X,Y Platform	Driven motor	Servo Motor System
		Position Precision	<1 µm
		Moving Speed	600 mm/s
Operating System	Computer PC		Industrial control computer: Intel high-end six- core CPU, 16GDDR memory, 1T hard disk
Operating System	Monitor		22 Inch LCD widescreen monitor